By: Mj Toledo
It turns out that even semiconductors need a little help making connections. Through its hybrid bonding technology, Adeia, a research and development company, is accelerating the adoption of new technologies in the media, entertainment, and semiconductor industries.
The Power of Hybrid Bonding
Hybrid bonding is an advanced semiconductor packaging technology that integrates various functional elements—logic, memory, and sensors—into compact, high-performance systems. Engineers use the direct bond interconnect (DBI®) process in this technology to connect different components, significantly improving electrical and thermal performance.
“Hybrid bonding can truly change semiconductor design and even manufacturing,” says Dr. Laura Mirkarimi, senior vice president and head of semiconductor engineering at Adeia. “Now that the demand for more powerful computing solutions is growing, it is an exciting time for our company.”
A Year of Remarkable Achievements
This 2024 has been a banner year for Adeia, marked by new feats and partnerships. The company’s long-term agreements with industry giants Kioxia Corporation and Western Digital, secured in 2023, have begun to bear fruit. These world leaders in flash memory and solid-state drives have licensed Adeia’s patent portfolio, including its hybrid bonding technology.
The industry has noticed Adeia’s commitment to technology. The company’s team received the “Best Session Paper” award at the Electronic Components and Technology Conference (ECTC) 2023 for its article, “Fine Pitch Die-to-Wafer Hybrid Bonding.” This demonstrates that Adeia dedicates itself to advancing hybrid bonding technology and addressing yield loss mechanisms.
Sharing Knowledge on the Global Stage
Adeia has participated in several prestigious technology conferences recently as part of its mission to drive development and share skillfulness. This global tour saw the company’s experts present at three major industry events, each offering insights into hybrid bonding technology.
The conference tour included the International Symposium on Microelectronics (IMAPS) Conference in Boston (October 1-3, 2024), the International Conference on Planarization/CMP Technology (ICPT) in Wiesbaden, Germany (October 16-18, 2024), and the Institute of Electrical and Electronics Engineers (IEEE) CPMT Symposium Japan (ICSJ) in Kyoto (November 13-15, 2024).
“These presentations represent a window into the future of technology. We showcased our technological skill and help shape the entire industry’s future by sharing our knowledge,” explains JoAnn Yamani, Adeia’s vice president.
Implications for the Future
The company’s work impacts more than semiconductors. After all, its technology makes way for more powerful and efficient computing technologies. Hybrid bonding can accelerate advancements in artificial intelligence, data processing, and a wide range of applications that rely on high-performance computing.
The world looks toward a future driven by advanced computing technologies, and Adeia’s work in hybrid bonding will open new doors for various industries. Moreover, the company’s consistent research and development focus positions it as a significant player in inspiring change in its industry.
“We turn ideas into reality,” states Paul Davis, its chief executive officer (CEO). As the company continues to challenge what is possible with hybrid bonding, it is clear that Adeia will directly affect the lives of millions of people, whether they know it or not.
Published by: Josh Tatunay